Assignee
SAKAGUCHI HIDEAKI
JP·9 granted patents·1 pending application·75 citations·filing 2009–2012
Top patents by PatentIndex Score
10 records- 0197US8536714B2Interposer, its manufacturing method, and semiconductor deviceSAKAGUCHI HIDEAKI·Filed 2012·Granted Sep 17, 2013·56 cites·15 claims
- 0283US8314344B2Wiring board and manufacturing method of the sameSAKAGUCHI HIDEAKI·Filed 2009·Granted Nov 20, 2012·11 cites·9 claims
- 0373US8330050B2Wiring board having heat intercepting memberSAKAGUCHI HIDEAKI·Filed 2009·Granted Dec 11, 2012·6 cites·16 claims
- 0468US8299628B2Conductive ball mounting apparatus having a movable conductive ball containerSAKAGUCHI HIDEAKI·Filed 2010·Granted Oct 30, 2012·2 cites·15 claims
- 0551US8183679B2Electronic part packageSAKAGUCHI HIDEAKI·Filed 2011·Granted May 22, 2012·0 cites·4 claims
- 0650US8777638B2Wiring board and method of manufacturing the sameSAKAGUCHI HIDEAKI·Filed 2012·Granted Jul 15, 2014·0 cites·2 claims
- 0748US8759685B2Wiring substrate and method of manufacturing the wiring substrateSAKAGUCHI HIDEAKI·Filed 2009·Granted Jun 24, 2014·0 cites·14 claims
- 0846US8299370B2Wiring board and method of manufacturing the sameSAKAGUCHI HIDEAKI·Filed 2010·Granted Oct 30, 2012·0 cites·2 claims
- 0941US8227909B2Semiconductor package and method of manufacturing the sameSAKAGUCHI HIDEAKI·Filed 2010·Granted Jul 24, 2012·0 cites·1 claims
- 1041US2012327574A1Electronic componentSAKAGUCHI HIDEAKI·Filed 2012·Application pending·0 cites
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