Assignee

SAKAI TADAHIKO

JP·2 granted patents·4 citations·filing 2007–2011

Technology mixH05K2 B23K1 H01R1 H10W1 Y10T1

Top patents by PatentIndex Score

2 records

0165US8188605B2Components joining method and components joining structureSAKAI TADAHIKO·Filed 2011·Granted May 29, 2012·2 cites·8 claims
0258US9015932B2Connecting method of electronic componentSAKAI TADAHIKO·Filed 2007·Granted Apr 28, 2015·2 cites·5 claims

Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →