Assignee

SAKATANI SHIGEAKI

JP·2 granted patents·11 citations·filing 2008–2010

Technology mixH05K2 Y02P2 B23K1 B32B1 C22C1 H10W1

Top patents by PatentIndex Score

2 records

0187US8598464B2Soldering material and electronic component assemblySAKATANI SHIGEAKI·Filed 2010·Granted Dec 3, 2013·10 cites·4 claims
0255US8179686B2Mounted structural body and method of manufacturing the sameSAKATANI SHIGEAKI·Filed 2008·Granted May 15, 2012·1 cites·12 claims

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