Assignee
SAKUYAMA SEIKI
JP·2 granted patents·6 citations·filing 2010–2011
Top patents by PatentIndex Score
2 records- 0179US8673050B2Conductive material, conductive paste, circuit board, and semiconductor deviceSAKUYAMA SEIKI·Filed 2010·Granted Mar 18, 2014·4 cites·6 claims
- 0266US8556157B2Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the sameSAKUYAMA SEIKI·Filed 2011·Granted Oct 15, 2013·2 cites·8 claims
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