Assignee
SASAKI KEIICHI
JP·2 granted patents·3 citations·filing 2008–2009
Top patents by PatentIndex Score
2 records- 0169US8409452B2Through-hole forming method, inkjet head, and silicon substrateSASAKI KEIICHI·Filed 2008·Granted Apr 2, 2013·3 cites·12 claims
- 0244US8157357B2Circuit substrate and liquid discharging apparatus with a first wiring layer directly connected to the substrate and a second wiring layer connected to the first wiring layer through a metal filmSASAKI KEIICHI·Filed 2009·Granted Apr 17, 2012·0 cites·5 claims
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