Assignee
SASAOKA KENJI
JP·3 granted patents·29 citations·filing 2006–2012
Top patents by PatentIndex Score
3 records- 0185US8198541B2Electronic component built-in wiring board and method for radiating heat generated at the sameSASAOKA KENJI·Filed 2007·Granted Jun 12, 2012·14 cites·9 claims
- 0283US8987901B2Component built-in wiring board and manufacturing method of component built-in wiring boardSASAOKA KENJI·Filed 2012·Granted Mar 24, 2015·5 cites·3 claims
- 0380US8737085B2Wiring board with a built-in component and method for manufacturing the sameSASAOKA KENJI·Filed 2006·Granted May 27, 2014·10 cites·22 claims
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