Assignee

SAWADA YOSHIHIRO

JP·1 granted patent·0 citations·filing 2011–2011

Technology mixC08L1 C09D1 H10P1 H10W1

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0133US8790990B2Silica-based film forming material for formation of air gaps, and method for forming air gapsSAWADA YOSHIHIRO·Filed 2011·Granted Jul 29, 2014·0 cites·6 claims

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