Assignee
SCHÖNLEBER MARTIN
DE·2 granted patents·26 citations·filing 2012–2012
Top patents by PatentIndex Score
2 records- 0190US9494409B2Test device for testing a bonding layer between wafer-shaped samples and test process for testing the bonding layerSCHÖNLEBER MARTIN·Filed 2012·Granted Nov 15, 2016·15 cites·4 claims
- 0288US9297645B2Apparatus and method for determining a depth of a region having a high aspect ratio that protrudes into a surface of a semiconductor waferSCHÖNLEBER MARTIN·Filed 2012·Granted Mar 29, 2016·11 cites·26 claims
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