Assignee
SEAH LEE HUA ALVIN
SG·1 granted patent·1 pending application·3 citations·filing 2011–2011
Technology mixH10W2
Top patents by PatentIndex Score
2 records- 0157US8736046B2Dual interlock heatsink assembly for enhanced cavity PBGA packages, and method of manufactureSEAH LEE HUA ALVIN·Filed 2011·Granted May 27, 2014·3 cites·13 claims
- 0225US2013069218A1High density package interconnect with copper heat spreader and method of making the sameSEAH LEE HUA ALVIN·Filed 2011·Application pending·0 cites
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