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SEARLS DAMION
US
2 patents
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US8659909B2
Feb 25, 2014
Method for reducing loadline impedance in a system
SEARLS DAMION
8 citations
77
US10251273B2
Apr 2, 2019
Mainboard assembly including a package overlying a die directly attached to the mainboard
SEARLS DAMION
2 citations
67