Assignee
SEDDON MICHAEL J
US·6 granted patents·1 pending application·25 citations·filing 2008–2013
Top patents by PatentIndex Score
7 records- 0189US8292690B2Thinned semiconductor wafer and method of thinning a semiconductor waferSEDDON MICHAEL J·Filed 2008·Granted Oct 23, 2012·14 cites·20 claims
- 0283US8084335B2Method of thinning a semiconductor wafer using a film frameSEDDON MICHAEL J·Filed 2008·Granted Dec 27, 2011·8 cites·22 claims
- 0371US8871613B2Semiconductor die singulation methodSEDDON MICHAEL J·Filed 2012·Granted Oct 28, 2014·2 cites·20 claims
- 0461US8445375B2Method for manufacturing a semiconductor componentSEDDON MICHAEL J·Filed 2009·Granted May 21, 2013·1 cites·10 claims
- 0555US9275957B2EM protected semiconductor dieSEDDON MICHAEL J·Filed 2013·Granted Mar 1, 2016·0 cites·15 claims
- 0649US9299664B2Method of forming an EM protected semiconductor dieSEDDON MICHAEL J·Filed 2010·Granted Mar 29, 2016·0 cites·10 claims
- 0737US2011175209A1Method of forming an em protected semiconductor dieSEDDON MICHAEL J·Filed 2010·Application pending·0 cites
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