Assignee
SEGAWA TAKESHI
JP·5 granted patents·37 citations·filing 2006–2009
Top patents by PatentIndex Score
5 records- 0188US8691666B2Method for producing chip with adhesive appliedSEGAWA TAKESHI·Filed 2008·Granted Apr 8, 2014·23 cites·10 claims
- 0277US8465011B2Fixing jig and method of processing workSEGAWA TAKESHI·Filed 2008·Granted Jun 18, 2013·6 cites·2 claims
- 0371US8529314B2Method of transporting work and apparatus with work handover mechanismSEGAWA TAKESHI·Filed 2008·Granted Sep 10, 2013·4 cites·1 claims
- 0471US8392011B2Semiconductor wafer processing tape winding body, semiconductor wafer processing tape sticking apparatus and semiconductor wafer processing apparatus that use the semiconductor wafer processing tape winding bodySEGAWA TAKESHI·Filed 2006·Granted Mar 5, 2013·4 cites·17 claims
- 0548US8276817B2Information media processing deviceSEGAWA TAKESHI·Filed 2009·Granted Oct 2, 2012·0 cites·4 claims
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