Assignee
SEKIHARA KANJI
JP·4 granted patents·4 pending applications·6 citations·filing 2007–2011
Top patents by PatentIndex Score
8 records- 0170US8404193B2Microchip and process for producing microchipSEKIHARA KANJI·Filed 2009·Granted Mar 26, 2013·3 cites·4 claims
- 0266US9238322B2Microchip, molding die for microchip, and manufacturing apparatus for manufacturing microchipSEKIHARA KANJI·Filed 2011·Granted Jan 19, 2016·2 cites·9 claims
- 0360US8268112B2Bonding method of resin memberSEKIHARA KANJI·Filed 2008·Granted Sep 18, 2012·1 cites·13 claims
- 0452US8123998B2Injection molding method and injection molding dieSEKIHARA KANJI·Filed 2009·Granted Feb 28, 2012·0 cites·16 claims
- 0547US2010176523A1Device for and Method of Manufacturing Optical PartSEKIHARA KANJI·Filed 2007·Application pending·0 cites
- 0644US2010060998A1MicrochipSEKIHARA KANJI·Filed 2008·Application pending·0 cites
- 0740US2010074815A1Master and MicroreactorSEKIHARA KANJI·Filed 2007·Application pending·0 cites
- 0836US2013221544A1Molding die, microchip manufactured by using molding die, and manufacturing apparatus for manufacturing microchipSEKIHARA KANJI·Filed 2011·Application pending·0 cites
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