Assignee
SEMICONDUCTOR MFG NORTH CHINA BEIJING CORPORATION
CN·3 granted patents·3 pending applications·0 citations·filing 2021–2024
Top patents by PatentIndex Score
6 records- 0156US12068233B2Adapter board and method for forming same, packaging method, and package structureSEMICONDUCTOR MFG NORTH CHINA BEIJING CORPORATION·Filed 2023·Granted Aug 20, 2024·0 cites·12 claims
- 0256US2025194275A1Photoelectric sensor and fabrication methods thereofSEMICONDUCTOR MFG NORTH CHINA BEIJING CORPORATION·Filed 2024·Application pending·0 cites
- 0350US11637059B2Adapter board and method for forming same, packaging method, and package structureSEMICONDUCTOR MFG NORTH CHINA BEIJING CORPORATION·Filed 2021·Granted Apr 25, 2023·0 cites·8 claims
- 0448US2023411524A1Semiconductor structure and forming method thereofSEMICONDUCTOR MFG NORTH CHINA BEIJING CORPORATION·Filed 2023·Application pending·0 cites
- 0538US2023326998A1Semiconductor structure and method for forming sameSEMICONDUCTOR MFG NORTH CHINA BEIJING CORPORATION·Filed 2023·Application pending·0 cites
- 0636US12159868B2Semiconductor structure and method for forming sameSEMICONDUCTOR MFG NORTH CHINA BEIJING CORPORATION·Filed 2022·Granted Dec 3, 2024·0 cites·20 claims
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