Assignee
SENDA TAKESHI
JP·4 granted patents·1 pending application·0 citations·filing 2010–2012
Top patents by PatentIndex Score
5 records- 0141US9059099B2Thermal treatment method of silicon wafer and silicon waferSENDA TAKESHI·Filed 2012·Granted Jun 16, 2015·0 cites·8 claims
- 0241US8252700B2Method of heat treating silicon waferSENDA TAKESHI·Filed 2010·Granted Aug 28, 2012·0 cites·8 claims
- 0339US8999864B2Silicon wafer and method for heat-treating silicon waferSENDA TAKESHI·Filed 2010·Granted Apr 7, 2015·0 cites·4 claims
- 0437US2013078588A1Method for heat-treating silicon waferSENDA TAKESHI·Filed 2012·Application pending·0 cites
- 0534US8399341B2Method for heat treating a silicon waferSENDA TAKESHI·Filed 2010·Granted Mar 19, 2013·0 cites·8 claims
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