Assignee
SENG ERIC TAN SWEE
SG·2 granted patents·0 citations·filing 2009–2012
Top patents by PatentIndex Score
2 records- 0151US8237290B2Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond padsSENG ERIC TAN SWEE·Filed 2009·Granted Aug 7, 2012·0 cites·17 claims
- 0250US9070641B2Methods for forming assemblies and multi-chip modules including stacked semiconductor diceSENG ERIC TAN SWEE·Filed 2012·Granted Jun 30, 2015·0 cites·15 claims
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