Assignee
SEZI RECAI
DE·1 granted patent·2 pending applications·43 citations·filing 2004–2010
Top patents by PatentIndex Score
3 records- 0195US8258633B2Semiconductor package and multichip arrangement having a polymer layer and an encapsulantSEZI RECAI·Filed 2010·Granted Sep 4, 2012·43 cites·19 claims
- 0240US2006237716A1Material and cell structure for storage applicationsSEZI RECAI·Filed 2006·Application pending·0 cites
- 0339US2007194301A1Semiconductor arrangement with non-volatile memoriesSEZI RECAI·Filed 2004·Application pending·0 cites
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