Assignee
SHEN GENG-SHIN
TW7 patents
Top patents by PatentIndex Score
US8431478B2Apr 30, 2013
Solder cap bump in semiconductor package and method of manufacturing the same
SHEN GENG-SHIN5 citations72
US8426255B2Apr 23, 2013
Chip package structure and method for manufacturing the same
SHEN GENG-SHIN2 citations62
US8212347B2Jul 3, 2012
Stacked chip package structure with leadframe having bus bar
SHEN GENG-SHIN1 citations61
US8207603B2Jun 26, 2012
Stacked chip package structure with leadframe having inner leads with transfer pad
SHEN GENG-SHIN1 citations50
US8169061B2May 1, 2012
Stacked chip package structure with leadframe having bus bar
SHEN GENG-SHIN1 citations50
US8058109B2Nov 15, 2011
Method for manufacturing a semiconductor structure
SHEN GENG-SHIN0 citations41
US8712932B2Apr 29, 2014
Computer implemented apparatus for generating and filtering creative proposal
SHEN GENG-SHIN0 citations32