Assignee
SHIGIHARA HIROMI
JP·3 granted patents·2 pending applications·15 citations·filing 2005–2011
Top patents by PatentIndex Score
5 records- 0187US8063489B2Semiconductor integrated circuit deviceSHIGIHARA HIROMI·Filed 2009·Granted Nov 22, 2011·13 cites·21 claims
- 0263US8592984B2Semiconductor integrated circuit device and method of manufacturing the sameSHIGIHARA HIROMI·Filed 2011·Granted Nov 26, 2013·2 cites·4 claims
- 0350US9466559B2Semiconductor integrated circuit deviceSHIGIHARA HIROMI·Filed 2011·Granted Oct 11, 2016·0 cites·16 claims
- 0450US2009315179A1Semiconductor device having solder bumps protruding beyond insulating filmsSHIGIHARA HIROMI·Filed 2009·Application pending·0 cites
- 0543US2006131365A1Method of manufacturing a semiconductor deviceSHIGIHARA HIROMI·Filed 2005·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when SHIGIHARA HIROMI files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →