Assignee
SHIH CHENG-HUNG
TW·7 granted patents·1 pending application·27 citations·filing 2011–2012
Top patents by PatentIndex Score
8 records- 0190US8501614B1Method for manufacturing fine-pitch bumps and structure thereofSHIH CHENG-HUNG·Filed 2012·Granted Aug 6, 2013·16 cites·7 claims
- 0277US8530344B1Method for manufacturing fine-pitch bumps and structure thereofSHIH CHENG-HUNG·Filed 2012·Granted Sep 10, 2013·5 cites·7 claims
- 0373US8497579B1Semiconductor packaging method and structure thereofSHIH CHENG-HUNG·Filed 2012·Granted Jul 30, 2013·4 cites·7 claims
- 0460US8581239B2Package structure and semiconductor structure thereofSHIH CHENG-HUNG·Filed 2012·Granted Nov 12, 2013·2 cites·9 claims
- 0538US8783897B2Lamp module with electronic connector adapterSHIH CHENG-HUNG·Filed 2011·Granted Jul 22, 2014·0 cites·8 claims
- 0636US8437142B2Bump structure and process of manufacturing the sameSHIH CHENG-HUNG·Filed 2011·Granted May 7, 2013·0 cites·15 claims
- 0736US8330280B1Bump structure and process of manufacturing the sameSHIH CHENG-HUNG·Filed 2011·Granted Dec 11, 2012·0 cites·8 claims
- 0835US2013214419A1Semiconductor packaging method and structure thereofSHIH CHENG-HUNG·Filed 2012·Application pending·0 cites
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