Assignee
SHIH DA-YUAN
0 granted patents·2 pending applications·0 citations·filing 2008–2008
Top patents by PatentIndex Score
2 records- 0147US2009197114A1Modification of pb-free solder alloy compositions to improve interlayer dielectric delamination in silicon devices and electromigration resistance in solder jointsSHIH DA-YUAN·Filed 2008·Application pending·0 cites
- 0247US2009197103A1Modification of pb-free solder alloy compositions to improve interlayer dielectric delamination in silicon devices and electromigration resistance in solder jointsSHIH DA-YUAN·Filed 2008·Application pending·0 cites
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