Assignee
SHIMOOSAKO KANJI
JP·2 granted patents·2 pending applications·5 citations·filing 2005–2006
Top patents by PatentIndex Score
4 records- 0169US8092900B2Solution, component for plating, insulating sheet, laminate, and printed circuit boardSHIMOOSAKO KANJI·Filed 2005·Granted Jan 10, 2012·5 cites·1 claims
- 0249US2009025966A1Fiber-resin composite, laminate, printed wiring board, and method for manufacturing printed wiring boardSHIMOOSAKO KANJI·Filed 2006·Application pending·0 cites
- 0347US8889250B2Plating target material, polyamic solution and polyimide resin solution which are used to form the plating target material, and printed-wiring board using themSHIMOOSAKO KANJI·Filed 2005·Granted Nov 18, 2014·0 cites·5 claims
- 0447US2009281267A1Material for planting and use thereofSHIMOOSAKO KANJI·Filed 2006·Application pending·0 cites
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