Assignee
SHIN HANGIL
KR·5 granted patents·1 pending application·103 citations·filing 2007–2012
Top patents by PatentIndex Score
6 records- 0196US9397050B2Semiconductor device and method of forming pre-molded semiconductor die having bumps embedded in encapsulantSHIN HANGIL·Filed 2009·Granted Jul 19, 2016·53 cites·17 claims
- 0294US8106498B2Integrated circuit packaging system with a dual board-on-chip structure and method of manufacture thereofSHIN HANGIL·Filed 2009·Granted Jan 31, 2012·38 cites·20 claims
- 0387US8318541B2Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor dieSHIN HANGIL·Filed 2010·Granted Nov 27, 2012·8 cites·19 claims
- 0470US9230898B2Integrated circuit packaging system with package-on-package and method of manufacture thereofSHIN HANGIL·Filed 2009·Granted Jan 5, 2016·4 cites·18 claims
- 0545US8723309B2Integrated circuit packaging system with through silicon via and method of manufacture thereofSHIN HANGIL·Filed 2012·Granted May 13, 2014·0 cites·18 claims
- 0644US2009127715A1Mountable integrated circuit package system with protrusionSHIN HANGIL·Filed 2007·Application pending·0 cites
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