Assignee
SILICON VALLEY GROUP THERMAL
US·8 granted patents·2 pending applications·447 citations·filing 1998–2001
Top patents by PatentIndex Score
10 records- 0194US6200389B1Single body injector and deposition chamberSILICON VALLEY GROUP THERMAL·Filed 1998·Granted Mar 13, 2001·156 cites·15 claims
- 0289US6143080AWafer processing reactor having a gas flow control system and methodSILICON VALLEY GROUP THERMAL·Filed 2000·Granted Nov 7, 2000·70 cites·21 claims
- 0387US6387764B1Trench isolation process to deposit a trench fill oxide prior to sidewall liner oxidation growthSILICON VALLEY GROUP THERMAL·Filed 2000·Granted May 14, 2002·102 cites·17 claims
- 0484US6206973B1Chemical vapor deposition system and methodSILICON VALLEY GROUP THERMAL·Filed 2000·Granted Mar 27, 2001·29 cites·20 claims
- 0582US6465044B1Chemical vapor deposition of silicon oxide films using alkylsiloxane oligomers with ozoneSILICON VALLEY GROUP THERMAL·Filed 2000·Granted Oct 15, 2002·27 cites·6 claims
- 0668US6352592B1Free floating shield and semiconductor processing systemSILICON VALLEY GROUP THERMAL·Filed 2000·Granted Mar 5, 2002·15 cites·24 claims
- 0762US6056824AFree floating shield and semiconductor processing systemSILICON VALLEY GROUP THERMAL·Filed 1998·Granted May 2, 2000·26 cites·42 claims
- 0857US6026589AWafer carrier and semiconductor apparatus for processing a semiconductor substrateSILICON VALLEY GROUP THERMAL·Filed 1998·Granted Feb 22, 2000·22 cites·11 claims
- 0935US2001010950A1Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer systemSILICON VALLEY GROUP THERMAL·Filed 2001·Application pending·0 cites
- 1033US2002134507A1Gas delivery metering tubeSILICON VALLEY GROUP THERMAL·Filed 2001·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when SILICON VALLEY GROUP THERMAL files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →