Assignee
SILTECTRA GMBH
DE45 patents
Top patents by PatentIndex Score
US12151314B2Nov 26, 2024
Device and method for applying pressure to stress-producing layers for improved guidance of a separation crack
SILTECTRA GMBH3 citations74
US11527441B2Dec 13, 2022
Method for producing a detachment area in a solid body
SILTECTRA GMBH3 citations73
US11014199B2May 25, 2021
Method of modifying a solid using laser light
SILTECTRA GMBH2 citations73
US11004723B2May 11, 2021
Wafer production method
SILTECTRA GMBH2 citations73
US10661392B2May 26, 2020
Splitting of a solid using conversion of material
SILTECTRA GMBH2 citations73
US10593590B2Mar 17, 2020
Combined wafer production method with laser treatment and temperature-induced stresses
SILTECTRA GMBH2 citations73
US10312135B2Jun 4, 2019
Combined wafer production method with laser treatment and temperature-induced stresses
SILTECTRA GMBH3 citations73
US11869810B2Jan 9, 2024
Method for reducing the thickness of solid-state layers provided with components
SILTECTRA GMBH2 citations72
US11772201B2Oct 3, 2023
Method for separating solid body layers from composite structures made of SiC and a metallic coating or electrical components
SILTECTRA GMBH2 citations72
US10994442B2May 4, 2021
Method for forming a crack in the edge region of a donor substrate, using an inclined laser beam
SILTECTRA GMBH3 citations72
US10978311B2Apr 13, 2021
Method for thinning solid body layers provided with components
SILTECTRA GMBH5 citations72
US10843380B2Nov 24, 2020
Method for the material-saving production of wafers and processing of wafers
SILTECTRA GMBH2 citations72
USRE50809EMar 3, 2026
Method of modifying a solid using laser light
SILTECTRA GMBH0 citations62
US12159805B2Dec 3, 2024
Method for producing wafers with modification lines of defined orientation
SILTECTRA GMBH1 citations62
US11996331B2May 28, 2024
Method for separating a solid body
SILTECTRA GMBH0 citations62
US11833617B2Dec 5, 2023
Splitting of a solid using conversion of material
SILTECTRA GMBH0 citations62
US11786995B2Oct 17, 2023
Nonplanar wafer and method for producing a nonplanar wafer
SILTECTRA GMBH0 citations62
US11699616B2Jul 11, 2023
Method for producing a layer of solid material
SILTECTRA GMBH0 citations62
US11518066B2Dec 6, 2022
Method of treating a solid layer bonded to a carrier substrate
SILTECTRA GMBH0 citations62
US11407066B2Aug 9, 2022
Splitting of a solid using conversion of material
SILTECTRA GMBH1 citations62
US11201081B2Dec 14, 2021
Method for separating thin layers of solid material from a solid body
SILTECTRA GMBH0 citations62
US10930560B2Feb 23, 2021
Laser-based separation method
SILTECTRA GMBH0 citations62
US10280107B2May 7, 2019
Method for guiding a crack in the peripheral region of a donor substrate
SILTECTRA GMBH1 citations62
US12211702B2Jan 28, 2025
Solid body and multi-component arrangement
SILTECTRA GMBH0 citations61
US11787083B2Oct 17, 2023
Production facility for separating wafers from donor substrates
SILTECTRA GMBH0 citations61
US11309191B2Apr 19, 2022
Method for modifying substrates based on crystal lattice dislocation density
SILTECTRA GMBH1 citations61
US11059202B2Jul 13, 2021
Method and device for producing planar modifications in solid bodies
SILTECTRA GMBH0 citations61
US12097641B2Sep 24, 2024
Method for forming a crack in an edge region of a donor substrate
SILTECTRA GMBH0 citations60
US12030216B2Jul 9, 2024
Method for separating wafers from donor substrates
SILTECTRA GMBH0 citations59
US10229835B2Mar 12, 2019
Splitting method and use of a material in a splitting method
SILTECTRA GMBH0 citations52
US10079171B2Sep 18, 2018
Combined method for producing solids, involving laser treatment and temperature-induced stresses to generate three-dimensional solids
SILTECTRA GMBH1 citations52
US11822307B2Nov 21, 2023
Laser conditioning of solid bodies using prior knowledge from previous machining steps
SILTECTRA GMBH0 citations51
US11664277B2May 30, 2023
Method for thinning solid-body layers provided with components
SILTECTRA GMBH0 citations51
US11130200B2Sep 28, 2021
Combined laser treatment of a solid body to be split
SILTECTRA GMBH0 citations51
US10676386B2Jun 9, 2020
Method for guiding a crack in the peripheral region of a donor substrate
SILTECTRA GMBH0 citations51
US12539565B2Feb 3, 2026
Method for producing short subcritical cracks in solid bodies
SILTECTRA GMBH0 citations50
US10825732B2Nov 3, 2020
Method of producing stresses in a semiconductor wafer
SILTECTRA GMBH0 citations50
US10580699B1Mar 3, 2020
Method and device for the production of wafers with a pre-defined break initiation point
SILTECTRA GMBH0 citations50
US10304738B2May 28, 2019
Method and device for the production of wafers with a pre-defined break initiation point
SILTECTRA GMBH0 citations50
US10269643B2Apr 23, 2019
Method and device for the production of wafers with a pre-defined break initiation point
SILTECTRA GMBH0 citations50
US10960574B2Mar 30, 2021
Combined wafer production method with a receiving layer having holes
SILTECTRA GMBH0 citations46
US10707068B2Jul 7, 2020
Combined wafer production method with a multi-component receiving layer
SILTECTRA GMBH0 citations46
US10858495B2Dec 8, 2020
Polymer hybrid material for use in a splitting method
SILTECTRA GMBH0 citations41
US10029277B2Jul 24, 2018
Method of producing large-scale layers of solid material
SILTECTRA GMBH0 citations40
US9754810B2Sep 5, 2017
Method for the production of a wafer with a carrier unit
SILTECTRA GMBH0 citations38