Assignee
SIMKA HARSONO S
US·1 granted patent·2 pending applications·8 citations·filing 2004–2010
Top patents by PatentIndex Score
3 records- 0179US8779589B2Liner layers for metal interconnectsSIMKA HARSONO S·Filed 2010·Granted Jul 15, 2014·8 cites·21 claims
- 0249US2008182021A1Continuous ultra-thin copper film formed using a low thermal budgetSIMKA HARSONO S·Filed 2007·Application pending·0 cites
- 0335US2006138087A1Copper containing abrasive particles to modify reactivity and performance of copper CMP slurriesSIMKA HARSONO S·Filed 2004·Application pending·0 cites
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