Assignee
SLAVOV NEDYALKO
CH·3 granted patents·1 pending application·3 citations·filing 2009–2011
Top patents by PatentIndex Score
4 records- 0158US8125074B2Laminated substrate for an integrated circuit BGA package and printed circuit boardsSLAVOV NEDYALKO·Filed 2009·Granted Feb 28, 2012·3 cites·13 claims
- 0240US8222722B2Integrated circuit package and deviceSLAVOV NEDYALKO·Filed 2009·Granted Jul 17, 2012·0 cites·21 claims
- 0335US9122807B2Interfacing a switch arraySLAVOV NEDYALKO·Filed 2011·Granted Sep 1, 2015·0 cites·18 claims
- 0430US2013207246A1Packaging an Integrated Circuit DieSLAVOV NEDYALKO·Filed 2011·Application pending·0 cites
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