Assignee
SMART PAC GMBH TECHNOLOGY SERV
DE·5 granted patents·9 citations·filing 2000–2008
Top patents by PatentIndex Score
5 records- 0151US7726543B2Method for the production of a soldered jointSMART PAC GMBH TECHNOLOGY SERV·Filed 2008·Granted Jun 1, 2010·0 cites·1 claims
- 0249US7360679B2Method for the production of a soldered connectionSMART PAC GMBH TECHNOLOGY SERV·Filed 2002·Granted Apr 22, 2008·3 cites·1 claims
- 0349US7106599B2Chip module and chip card module for producing a chip cardSMART PAC GMBH TECHNOLOGY SERV·Filed 2001·Granted Sep 12, 2006·2 cites·8 claims
- 0449US6407457B1Contact-bumpless chip contacting method and an electronic circuit produced by said methodSMART PAC GMBH TECHNOLOGY SERV·Filed 2000·Granted Jun 18, 2002·4 cites·9 claims
- 0538US7049213B2Method for producing a contact substrate and corresponding contact substrateSMART PAC GMBH TECHNOLOGY SERV·Filed 2002·Granted May 23, 2006·0 cites·19 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →