Assignee

SOLIDUV INC

US·1 granted patent·1 citations·filing 2017–2017

Technology mixH01L1 H05K1 H10W1 Y02P1

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0160US10410958B2Strain-tolerant die attach with improved thermal conductivity, and method of fabricationSOLIDUV INC·Filed 2017·Granted Sep 10, 2019·1 cites·35 claims

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