Assignee
SPEEDFAM IPEC CO LTD
US·8 granted patents·271 citations·filing 1999–2000
Top patents by PatentIndex Score
8 records- 0194US6402596B1Single-side polishing method for substrate edge, and apparatus thereforSPEEDFAM IPEC CO LTD·Filed 2000·Granted Jun 11, 2002·100 cites·7 claims
- 0285US6406589B1Processing apparatus for etching the edge of a silicon waferSPEEDFAM IPEC CO LTD·Filed 1999·Granted Jun 18, 2002·78 cites·4 claims
- 0370US6238272B1Polishing compound and a polishing method for silicon waferSPEEDFAM IPEC CO LTD·Filed 1999·Granted May 29, 2001·23 cites·12 claims
- 0468US6360687B1Wafer flattening systemSPEEDFAM IPEC CO LTD·Filed 1999·Granted Mar 26, 2002·38 cites·16 claims
- 0555US6451217B1Wafer etching methodSPEEDFAM IPEC CO LTD·Filed 2000·Granted Sep 17, 2002·5 cites·8 claims
- 0644US6250997B1Processing machineSPEEDFAM IPEC CO LTD·Filed 1999·Granted Jun 26, 2001·18 cites·6 claims
- 0735US6302995B1Local etching apparatusSPEEDFAM IPEC CO LTD·Filed 1999·Granted Oct 16, 2001·5 cites·10 claims
- 0830US6303511B2Wafer flattening processSPEEDFAM IPEC CO LTD·Filed 1999·Granted Oct 16, 2001·4 cites·2 claims
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