Assignee
SRIVASTAVA RAVI PRAKASH
US·3 granted patents·1 pending application·35 citations·filing 2010–2010
Top patents by PatentIndex Score
4 records- 0194US8114769B1Methods and structures to enable self-aligned via etch for Cu damascene structure using trench first metal hard mask (TFMHM) schemeSRIVASTAVA RAVI PRAKASH·Filed 2010·Granted Feb 14, 2012·29 cites·20 claims
- 0273US8420947B2Integrated circuit system with ultra-low k dielectric and method of manufacture thereofSRIVASTAVA RAVI PRAKASH·Filed 2010·Granted Apr 16, 2013·3 cites·20 claims
- 0371US8822342B2Method to reduce depth delta between dense and wide features in dual damascene structuresSRIVASTAVA RAVI PRAKASH·Filed 2010·Granted Sep 2, 2014·3 cites·18 claims
- 0434US2012100716A1Method to improve reliability (EM and TDDB) with post silylation plasma treatment process for copper damascene structuresSRIVASTAVA RAVI PRAKASH·Filed 2010·Application pending·0 cites
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