Assignee
ST AMAND ROGER D
US·5 granted patents·136 citations·filing 2008–2011
Top patents by PatentIndex Score
5 records- 0197US8633598B1Underfill contacting stacking balls package fabrication method and structureST AMAND ROGER D·Filed 2011·Granted Jan 21, 2014·53 cites·18 claims
- 0294US8129824B1Shielding for a semiconductor packageST AMAND ROGER D·Filed 2008·Granted Mar 6, 2012·54 cites·21 claims
- 0385US8072083B1Stacked electronic component package having film-on-wire spacerST AMAND ROGER D·Filed 2010·Granted Dec 6, 2011·10 cites·17 claims
- 0484US8836115B1Stacked inverted flip chip package and fabrication methodST AMAND ROGER D·Filed 2008·Granted Sep 16, 2014·19 cites·13 claims
- 0547US8084868B1Semiconductor package with fast power-up cycle and method of making sameST AMAND ROGER D·Filed 2010·Granted Dec 27, 2011·0 cites·12 claims
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