Assignee
ST ASSEMBLY TEST SERVICES LTD
SG·50 granted patents·1,636 citations·filing 1999–2010
Top patents by PatentIndex Score
50 records- 0199US6861288B2Stacked semiconductor packages and method for the fabrication thereofST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Mar 1, 2005·308 cites·8 claims
- 0296US7309913B2Stacked semiconductor packagesST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Dec 18, 2007·94 cites·8 claims
- 0395US7005325B2Semiconductor package with passive device integrationST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Feb 28, 2006·99 cites·10 claims
- 0494US6534859B1Semiconductor package having heat sink attached to pre-molded cavities and method for creating the packageST ASSEMBLY TEST SERVICES LTD·Filed 2002·Granted Mar 18, 2003·118 cites·63 claims
- 0594US6420779B1Leadframe based chip scale package and method of producing the sameST ASSEMBLY TEST SERVICES LTD·Filed 1999·Granted Jul 16, 2002·263 cites·8 claims
- 0693US8035204B2Large die package structures and fabrication method thereforST ASSEMBLY TEST SERVICES LTD·Filed 2010·Granted Oct 11, 2011·13 cites·12 claims
- 0793US6775140B2Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devicesST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Aug 10, 2004·79 cites·24 claims
- 0893US6537848B2Super thin/super thermal ball grid array packageST ASSEMBLY TEST SERVICES LTD·Filed 2001·Granted Mar 25, 2003·79 cites·13 claims
- 0990US7700404B2Large die package structures and fabrication method thereforST ASSEMBLY TEST SERVICES LTD·Filed 2006·Granted Apr 20, 2010·16 cites·16 claims
- 1088US7960816B2Semiconductor package with passive device integrationST ASSEMBLY TEST SERVICES LTD·Filed 2005·Granted Jun 14, 2011·15 cites·12 claims
- 1188US7205651B2Thermally enhanced stacked die package and fabrication methodST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Apr 17, 2007·45 cites·20 claims
- 1287US6927479B2Method of manufacturing a semiconductor package for a die larger than a die padST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Aug 9, 2005·37 cites·8 claims
- 1387US6479903B2Flip chip thermally enhanced ball grid arrayST ASSEMBLY TEST SERVICES LTD·Filed 2001·Granted Nov 12, 2002·42 cites·8 claims
- 1485US7339258B2Dual row leadframe and fabrication methodST ASSEMBLY TEST SERVICES LTD·Filed 2006·Granted Mar 4, 2008·11 cites·10 claims
- 1585US6858470B1Method for fabricating semiconductor packages, and leadframe assemblies for the fabrication thereofST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Feb 22, 2005·36 cites·13 claims
- 1684US7129569B2Large die package structures and fabrication method thereforST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Oct 31, 2006·28 cites·16 claims
- 1783US6960493B2Semiconductor device packageST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Nov 1, 2005·30 cites·16 claims
- 1882US7242101B2Integrated circuit die with pedestalST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Jul 10, 2007·27 cites·44 claims
- 1981US7060536B2Dual row leadframe and fabrication methodST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Jun 13, 2006·26 cites·9 claims
- 2080US6737298B2Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the sameST ASSEMBLY TEST SERVICES LTD·Filed 2002·Granted May 18, 2004·31 cites·18 claims
- 2179US7064420B2Integrated circuit leadframe with ground planeST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Jun 20, 2006·28 cites·20 claims
- 2275US7153725B2Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods thereforST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Dec 26, 2006·21 cites·20 claims
- 2375US6586925B2Method and apparatus for establishing quick and reliable connection between a semiconductor device handler plate and a semiconductor device test head plateST ASSEMBLY TEST SERVICES LTD·Filed 2001·Granted Jul 1, 2003·28 cites·54 claims
- 2470US6483177B1Leaded semiconductor packages and method of trimming and singulating such packagesST ASSEMBLY TEST SERVICES LTD·Filed 2000·Granted Nov 19, 2002·17 cites·5 claims
- 2569US7217599B2Integrated circuit package with leadframe locked encapsulation and method of manufacture thereforST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted May 15, 2007·13 cites·9 claims
- 2669US7008820B2Chip scale package with open substrateST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Mar 7, 2006·11 cites·11 claims
- 2768US7595551B2Semiconductor package for a large dieST ASSEMBLY TEST SERVICES LTD·Filed 2005·Granted Sep 29, 2009·3 cites·10 claims
- 2868US7575956B2Fabrication method for semiconductor package heat spreadersST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Aug 18, 2009·12 cites·20 claims
- 2966US8030783B2Integrated circuit package with open substrateST ASSEMBLY TEST SERVICES LTD·Filed 2009·Granted Oct 4, 2011·2 cites·14 claims
- 3065US7786593B2Integrated circuit die with pedestalST ASSEMBLY TEST SERVICES LTD·Filed 2007·Granted Aug 31, 2010·2 cites·20 claims
- 3165US7443039B2System for different bond pads in an integrated circuit packageST ASSEMBLY TEST SERVICES LTD·Filed 2005·Granted Oct 28, 2008·3 cites·10 claims
- 3265US7413933B2Integrated circuit package with leadframe locked encapsulation and method of manufacture thereforST ASSEMBLY TEST SERVICES LTD·Filed 2007·Granted Aug 19, 2008·2 cites·20 claims
- 3364US7381593B2Method and apparatus for stacked die packagingST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Jun 3, 2008·17 cites·10 claims
- 3463US6979907B2Integrated circuit packageST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Dec 27, 2005·9 cites·10 claims
- 3560US6759752B2Single unit automated assembly of flex enhanced ball grid array packagesST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Jul 6, 2004·8 cites·12 claims
- 3658US7135760B2Moisture resistant integrated circuit leadframe packageST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Nov 14, 2006·8 cites·18 claims
- 3757US7091596B2Semiconductor packages and leadframe assembliesST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Aug 15, 2006·6 cites·10 claims
- 3857US6617525B2Molded stiffener for flexible circuit moldingST ASSEMBLY TEST SERVICES LTD·Filed 2002·Granted Sep 9, 2003·6 cites·6 claims
- 3956US6855573B2Integrated circuit package and manufacturing method therefor with unique interconnectorST ASSEMBLY TEST SERVICES LTD·Filed 2002·Granted Feb 15, 2005·6 cites·10 claims
- 4054US7091469B2Packaging for optoelectronic devicesST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Aug 15, 2006·6 cites·20 claims
- 4153US7863730B2Array-molded package heat spreader and fabrication method thereforST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Jan 4, 2011·5 cites·20 claims
- 4253US7327025B2Heat spreader for thermally enhanced semiconductor packageST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Feb 5, 2008·5 cites·19 claims
- 4350US6750534B2Heat spreader hole pin 1 identifierST ASSEMBLY TEST SERVICES LTD·Filed 2002·Granted Jun 15, 2004·4 cites·4 claims
- 4450US6604395B2Semi-automated probe benderST ASSEMBLY TEST SERVICES LTD·Filed 2001·Granted Aug 12, 2003·6 cites·20 claims
- 4549US7626277B2Integrated circuit package with open substrateST ASSEMBLY TEST SERVICES LTD·Filed 2005·Granted Dec 1, 2009·0 cites·11 claims
- 4646US6686258B2Method of trimming and singulating leaded semiconductor packagesST ASSEMBLY TEST SERVICES LTD·Filed 2002·Granted Feb 3, 2004·2 cites·3 claims
- 4745US6525553B1Ground pin concept for singulated ball grid arrayST ASSEMBLY TEST SERVICES LTD·Filed 2000·Granted Feb 25, 2003·6 cites·5 claims
- 4844US7005370B2Method of manufacturing different bond pads on the same substrate of an integrated circuit packageST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Feb 28, 2006·2 cites·10 claims
- 4939US7306133B2System for fabricating an integrated circuit package on a printed circuit boardST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Dec 11, 2007·1 cites·10 claims
- 5039US6770962B2Disposable mold runner gate for substrate based electronic packagesST ASSEMBLY TEST SERVICES LTD·Filed 2002·Granted Aug 3, 2004·0 cites·8 claims
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