Assignee
STATS CHIPPAC INC
SG·11 granted patents·193 citations·filing 2005–2009
Top patents by PatentIndex Score
11 records- 0197US7608921B2Multi-layer semiconductor packageSTATS CHIPPAC INC·Filed 2006·Granted Oct 27, 2009·63 cites·24 claims
- 0295US7550828B2Leadframe package for MEMS microphone assemblySTATS CHIPPAC INC·Filed 2007·Granted Jun 23, 2009·30 cites·19 claims
- 0395US7279786B2Nested integrated circuit package on package systemSTATS CHIPPAC INC·Filed 2005·Granted Oct 9, 2007·39 cites·20 claims
- 0491US7994626B2Multi-layer semiconductor package with vertical connectors and method of manufacture thereofSTATS CHIPPAC INC·Filed 2009·Granted Aug 9, 2011·18 cites·34 claims
- 0587US7713782B2Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud-bumpsSTATS CHIPPAC INC·Filed 2006·Granted May 11, 2010·12 cites·17 claims
- 0686US8037918B2Pick-up heads and systems for die bonding and related applicationsSTATS CHIPPAC INC·Filed 2006·Granted Oct 18, 2011·17 cites·16 claims
- 0774US7612444B2Semiconductor package with flow controllerSTATS CHIPPAC INC·Filed 2007·Granted Nov 3, 2009·5 cites·32 claims
- 0870US7622811B2Semiconductor assembly with component attached on die back sideSTATS CHIPPAC INC·Filed 2006·Granted Nov 24, 2009·4 cites·16 claims
- 0966US8035205B2Molding compound flow controllerSTATS CHIPPAC INC·Filed 2007·Granted Oct 11, 2011·4 cites·64 claims
- 1059US8021931B2Direct via wire bonding and method of assembling the sameSTATS CHIPPAC INC·Filed 2007·Granted Sep 20, 2011·1 cites·25 claims
- 1154US7952211B2Semiconductor assembly with component pads attached on die back sideSTATS CHIPPAC INC·Filed 2009·Granted May 31, 2011·0 cites·10 claims
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