Assignee
SU KENG-LI
TW·3 granted patents·2 pending applications·21 citations·filing 2005–2012
Top patents by PatentIndex Score
5 records- 0186US8219340B2Monitoring method for through-silicon vias of three-dimensional intergrated circuit (3D IC) and apparatus using the sameSU KENG-LI·Filed 2009·Granted Jul 10, 2012·11 cites·10 claims
- 0280US8581419B2Multi-chip stack structureSU KENG-LI·Filed 2010·Granted Nov 12, 2013·7 cites·7 claims
- 0376US9064837B2Monitoring method for three-dimensional intergrated circuit (3D IC) and apparatus using the sameSU KENG-LI·Filed 2012·Granted Jun 23, 2015·3 cites·11 claims
- 0436US2012018723A1Structure and method for testing through-silicon via (tsv)SU KENG-LI·Filed 2010·Application pending·0 cites
- 0535US2006243974A1Thin-film transistorSU KENG-LI·Filed 2005·Application pending·0 cites
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