Assignee

SU LI-LIN

TW·2 granted patents·8 citations·filing 2008–2012

Technology mixH10W2 H01L1 H10D1 H10P1

Top patents by PatentIndex Score

2 records

0182US9136206B2Copper contact plugs with barrier layersSU LI-LIN·Filed 2012·Granted Sep 15, 2015·5 cites·19 claims
0269US8252690B2In situ Cu seed layer formation for improving sidewall coverageSU LI-LIN·Filed 2008·Granted Aug 28, 2012·3 cites·9 claims

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