Assignee
SUGIMURA HIROYUKI
JP·2 granted patents·8 citations·filing 2010–2012
Top patents by PatentIndex Score
2 records- 0185US8784973B2Resin bonding method by photoirradiation, method for producing resin article, resin article produced by the same method, method for producing microchip, and microchip produced by the same methodSUGIMURA HIROYUKI·Filed 2012·Granted Jul 22, 2014·8 cites·18 claims
- 0242US8246774B2Resin bonding method by photoirradiation, method for producing resin article, resin article produced by the same method, method for producing microchip, and microchip produced by the same methodSUGIMURA HIROYUKI·Filed 2010·Granted Aug 21, 2012·0 cites·17 claims
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