Assignee
SUMITA KAZUAKI
JP·2 granted patents·2 pending applications·8 citations·filing 2006–2012
Top patents by PatentIndex Score
4 records- 0189US8828806B2Dam composition for use with multilayer semiconductor package underfill material, and fabrication of multilayer semiconductor package using the sameSUMITA KAZUAKI·Filed 2010·Granted Sep 9, 2014·8 cites·9 claims
- 0243US2006204762A1Liquid epoxy resin composition and semiconductor deviceSUMITA KAZUAKI·Filed 2006·Application pending·0 cites
- 0338US9018281B2Set of resin compositions for preparing system-in-package type semiconductor deviceSUMITA KAZUAKI·Filed 2011·Granted Apr 28, 2015·0 cites·5 claims
- 0437US2012184646A1Semiconductor-encapsulating liquid epoxy resin composition and semiconductor deviceSUMITA KAZUAKI·Filed 2012·Application pending·0 cites
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