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SUN MING
US22 patents
Top patents by PatentIndex Score
USD724254SMar 10, 2015
Mushroom lamp
SUN MING73 citations98
US8670211B1Mar 11, 2014
Method and system for providing high magnetic flux saturation CoFe films
SUN MING153 citations98
US8441756B1May 14, 2013
Method and system for providing an antiferromagnetically coupled writer
SUN MING150 citations98
US8998111B2Apr 7, 2015
Variable flow concentration product dispenser
SUN MING7 citations84
USD679854SApr 9, 2013
Electronic candle light
SUN MING10 citations84
US8124453B2Feb 28, 2012
Vertically packaged MOSFET and IC power devices as integrated module using 3D interconnected laminates
SUN MING10 citations84
US8159828B2Apr 17, 2012
Low profile flip chip power module and method of making
SUN MING15 citations81
US9337132B2May 10, 2016
Methods and configuration for manufacturing flip chip contact (FCC) power package
SUN MING3 citations73
US8058646B2Nov 15, 2011
Programmable resistive memory cell with oxide layer
SUN MING4 citations73
US8446752B2May 21, 2013
Programmable metallization cell switch and memory units containing the same
SUN MING4 citations63
US8426960B2Apr 23, 2013
Wafer level chip scale packaging
SUN MING3 citations63
US8330264B2Dec 11, 2012
Packaging configurations for vertical electronic devices using conductive traces disposed on laminated board layers
SUN MING2 citations63
US8168477B2May 1, 2012
Packaging configurations for vertical electronic devices using conductive traces disposed on laminated board layers
SUN MING2 citations63
US7202113B2Apr 10, 2007
Wafer level bumpless method of making a flip chip mounted semiconductor device package
SUN MING4 citations60
US9387499B2Jul 12, 2016
Variable flow concentration product dispenser
SUN MING1 citations52
US8583606B2Nov 12, 2013
Storing method of performance data and system thereof
SUN MING1 citations52
US8105549B2Jan 31, 2012
Sample collection device
SUN MING1 citations52
US8564049B2Oct 22, 2013
Flip chip contact (FCC) power package
SUN MING1 citations51
US8288753B2Oct 16, 2012
Programmable resistive memory cell with oxide layer
SUN MING0 citations51
US7466014B2Dec 16, 2008
Flip chip mounted semiconductor device package having a dimpled leadframe
SUN MING0 citations49
US8909666B2Dec 9, 2014
Data query system and constructing method thereof and corresponding data query method
SUN MING0 citations42
US8623651B2Jan 7, 2014
Enhancin gene bel1 from Bacillus thuringiensis and its use in biological insecticide
SUN MING1 citations42