Assignee
SUTHIWONGSUNTHORN NATHAPONG
SG·2 granted patents·47 citations·filing 2009–2011
Technology mixH10W2
Top patents by PatentIndex Score
2 records- 0193US8659162B2Semiconductor device having an interconnect structure with TSV using encapsulant for structural supportSUTHIWONGSUNTHORN NATHAPONG·Filed 2011·Granted Feb 25, 2014·19 cites·25 claims
- 0293US8067308B2Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural supportSUTHIWONGSUNTHORN NATHAPONG·Filed 2009·Granted Nov 29, 2011·28 cites·27 claims
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