Assignee
SUWA YORIYUKI
JP·3 granted patents·2 citations·filing 2011–2012
Top patents by PatentIndex Score
3 records- 0172US9476138B2Composite plating liquidSUWA YORIYUKI·Filed 2012·Granted Oct 25, 2016·1 cites·5 claims
- 0256US9136200B2Heat radiating component and method of producing sameSUWA YORIYUKI·Filed 2011·Granted Sep 15, 2015·1 cites·6 claims
- 0339US9093417B2Heat radiating component and semiconductor package having the sameSUWA YORIYUKI·Filed 2012·Granted Jul 28, 2015·0 cites·13 claims
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