Assignee
SUZHOU SHINHAO MAT LLC
CN·5 granted patents·3 pending applications·0 citations·filing 2016–2024
Top patents by PatentIndex Score
8 records- 0173US11802345B2Metal material with thermodynamic anisotropy and a method of preparing the sameSUZHOU SHINHAO MAT LLC·Filed 2022·Granted Oct 31, 2023·0 cites·4 claims
- 0269US11242607B2Metal material with thermodynamic anisotropy and a method of preparing the sameSUZHOU SHINHAO MAT LLC·Filed 2019·Granted Feb 8, 2022·0 cites·4 claims
- 0367US2024328023A1Method of electroplating stress-free copper filmSUZHOU SHINHAO MAT LLC·Filed 2024·Application pending·0 cites
- 0463US10604857B2Copper crystal particles having a highly preferred orientation and a preparation method thereofSUZHOU SHINHAO MAT LLC·Filed 2017·Granted Mar 31, 2020·0 cites·4 claims
- 0562US11613824B2Bamboo-like copper crystal particles having a highly preferred orientationSUZHOU SHINHAO MAT LLC·Filed 2020·Granted Mar 28, 2023·0 cites·2 claims
- 0661US9920023B2Leveling composition and method for electrodeposition of metals in microelectronicsSUZHOU SHINHAO MAT LLC·Filed 2016·Granted Mar 20, 2018·0 cites·16 claims
- 0753US2022064813A1Method of electroplating stress-free copper filmSUZHOU SHINHAO MAT LLC·Filed 2021·Application pending·0 cites
- 0832US2020080215A1A method for preparing electroplating copper layer with preferred growth orientationSUZHOU SHINHAO MAT LLC·Filed 2017·Application pending·0 cites
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