Assignee
Shen wen-wei
TW·4 granted patents·54 citations·filing 2009–2010
Top patents by PatentIndex Score
4 records- 0193US9142533B2Substrate interconnections having different sizesShen wen-wei·Filed 2010·Granted Sep 22, 2015·18 cites·19 claims
- 0293US8241963B2Recessed pillar structureShen wen-wei·Filed 2010·Granted Aug 14, 2012·18 cites·20 claims
- 0392US8901736B2Strength of micro-bump jointsShen wen-wei·Filed 2010·Granted Dec 2, 2014·15 cites·20 claims
- 0466US8178970B2Strong interconnection post geometryShen wen-wei·Filed 2009·Granted May 15, 2012·3 cites·18 claims
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