Assignee
TACTICAL FABS INC
US·8 granted patents·505 citations·filing 1988–2001
Top patents by PatentIndex Score
8 records- 0193US5182632AHigh density multichip package with interconnect structure and heatsinkTACTICAL FABS INC·Filed 1991·Granted Jan 26, 1993·180 cites·51 claims
- 0288US5691949AVery high density wafer scale device architectureTACTICAL FABS INC·Filed 1996·Granted Nov 25, 1997·63 cites·16 claims
- 0388US4836861ASolar cell and cell mountTACTICAL FABS INC·Filed 1988·Granted Jun 6, 1989·94 cites·55 claims
- 0487US5223741APackage for an integrated circuit structureTACTICAL FABS INC·Filed 1989·Granted Jun 29, 1993·76 cites·47 claims
- 0574US5315130AVery high density wafer scale device architectureTACTICAL FABS INC·Filed 1990·Granted May 24, 1994·29 cites·51 claims
- 0674US5252507AVery high density wafer scale device architectureTACTICAL FABS INC·Filed 1990·Granted Oct 12, 1993·37 cites·11 claims
- 0770US5514884AVery high density wafer scale device architectureTACTICAL FABS INC·Filed 1994·Granted May 7, 1996·23 cites·5 claims
- 0842US6653121B2Roughened and oxidized well chips and method of making sameTACTICAL FABS INC·Filed 2001·Granted Nov 25, 2003·3 cites·1 claims
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