Assignee
TAIWAN SEMICONDUCTOR MAUNFACTU
TW·2 granted patents·59 citations·filing 2002–2005
Top patents by PatentIndex Score
2 records- 0177US6765228B2Bonding pad with separate bonding and probing areasTAIWAN SEMICONDUCTOR MAUNFACTU·Filed 2002·Granted Jul 20, 2004·49 cites·17 claims
- 0276US7341939B2Method for patterning micro features by using developable bottom anti-reflection coatingTAIWAN SEMICONDUCTOR MAUNFACTU·Filed 2005·Granted Mar 11, 2008·10 cites·13 claims
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