Assignee
TAKAHASHI YOSHIMI
JP·4 granted patents·2 pending applications·11 citations·filing 2009–2011
Top patents by PatentIndex Score
6 records- 0173US8193644B2Pop precursor with interposer for top package bond pad pitch compensationTAKAHASHI YOSHIMI·Filed 2011·Granted Jun 5, 2012·3 cites·11 claims
- 0269US8470641B2Exposed moldTAKAHASHI YOSHIMI·Filed 2009·Granted Jun 25, 2013·4 cites·12 claims
- 0367US8278142B2Combined metallic bonding and molding for electronic assemblies including void-reduced underfillTAKAHASHI YOSHIMI·Filed 2009·Granted Oct 2, 2012·4 cites·21 claims
- 0450US8304883B2Semiconductor device having multiple semiconductor elementsTAKAHASHI YOSHIMI·Filed 2011·Granted Nov 6, 2012·0 cites·2 claims
- 0548US2010159699A1Sandblast etching for through semiconductor viasTAKAHASHI YOSHIMI·Filed 2009·Application pending·0 cites
- 0634US2011278890A1Massage chairTAKAHASHI YOSHIMI·Filed 2010·Application pending·0 cites
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