Assignee
TAKASAWA YUSHIN
JP·3 granted patents·14 citations·filing 2009–2011
Top patents by PatentIndex Score
3 records- 0189US9318316B2Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatus for forming thin film containing at least two different elementsTAKASAWA YUSHIN·Filed 2009·Granted Apr 19, 2016·7 cites·16 claims
- 0278US8409988B2Method of manufacturing semiconductor device and substrate processing apparatusTAKASAWA YUSHIN·Filed 2011·Granted Apr 2, 2013·4 cites·12 claims
- 0373US8410001B2Method of manufacturing semiconductor device, method of processing substrate, and substrate processing apparatusTAKASAWA YUSHIN·Filed 2011·Granted Apr 2, 2013·3 cites·15 claims
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