Assignee

TAKASUKA EIRYO

JP·1 granted patent·9 citations·filing 2008–2008

Technology mixC23C1 C30B1 H01J1 Y10T1

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0187US8628616B2Vapor-phase process apparatus, vapor-phase process method, and substrateTAKASUKA EIRYO·Filed 2008·Granted Jan 14, 2014·9 cites·8 claims

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