Assignee
TAM SAMUEL
US3 patents
Top patents by PatentIndex Score
US8642387B2Feb 4, 2014
Method of fabricating stacked packages using laser direct structuring
TAM SAMUEL7 citations77
US9136289B2Sep 15, 2015
Camera module housing having built-in conductive traces to accommodate stacked dies using flip chip connections
TAM SAMUEL4 citations69
US8913180B2Dec 16, 2014
Folded tape package for electronic devices
TAM SAMUEL0 citations48