Assignee
TAMURA KAKEN CORP
JP·4 granted patents·6 pending applications·36 citations·filing 1993–2009
Top patents by PatentIndex Score
10 records- 0174US6475701B2Active energy beam curable composition and printed wiring boardTAMURA KAKEN CORP·Filed 2001·Granted Nov 5, 2002·19 cites·20 claims
- 0252US5468784APhotopolymerizable resin compositionTAMURA KAKEN CORP·Filed 1994·Granted Nov 21, 1995·11 cites·6 claims
- 0345US2010112361A1Method of removing lead, reclaimed metals and reclaimed productsTAMURA KAKEN CORP·Filed 2009·Application pending·0 cites
- 0439US6726780B2Lead-free solder, and paste solder compositionTAMURA KAKEN CORP·Filed 2003·Granted Apr 27, 2004·2 cites·4 claims
- 0538US2005173678A1Surface treatment agents for metal films of printed circuit boardsTAMURA KAKEN CORP·Filed 2005·Application pending·0 cites
- 0638US2004211291A1Method of manufacturing fine metal particles, substance containing fine metal particles, and paste solder compositionTAMURA KAKEN CORP·Filed 2004·Application pending·0 cites
- 0733US2003047034A1Method of manufacturing fine metal particles, substance containing fine metal particles, and paste solder compositionTAMURA KAKEN CORP·Filed 2002·Application pending·0 cites
- 0832US2005181215A1Thermosetting resin compositions and film articlesTAMURA KAKEN CORP·Filed 2005·Application pending·0 cites
- 0932US2005197425A1Thermosetting resin compositions, resin films and film articlesTAMURA KAKEN CORP·Filed 2005·Application pending·0 cites
- 1026US5735973APrinted circuit board surface protective agentTAMURA KAKEN CORP·Filed 1993·Granted Apr 7, 1998·4 cites·6 claims
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